A development effort to create expandable modular hardware platforms for building embedded systems and IoT devices
The HIO core-board is roughly the same size as a fresh stack of Post-It notes and fits in a 2-gang electrical box
The Lego-like 3D expandable open modular design allows for 3 directions of expansion, up and down. side to side, and front and back.
The 200-pin top and bottom female headers allow to bring out many of the peripherals, connectivity, power and UI resources.
The HIoTX is 80% Smaller than the Mini-ITX form factor and 20% Smaller than the tiny PICO-ITX standard.